IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies, provides procedures for rework, repair and modification of printed board assemblies.

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Description

IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies, provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.